Pulidora Roto-Orbital G Plus

A Dual Action (DA) polisher combines rotary and oscillating movements, creating a smoother and generally less aggressive polishing action. This makes DA polishers popular for refining, finishing and reducing the risk of holograms or swirl marks during polishing.

A Rotary polisher spins in a continuous circular motion, delivering a more direct and aggressive cutting action that is well suited to heavier defect removal and faster correction speeds.

While Rotary polishing is broadly considered more aggressive than Dual Action polishing, actual cut speed and finish levels will vary depending on several factors including substrate condition and age, compound and applicator choice, machine speed, user technique and the size and throw of the machine being used. For example, the tighter orbit and high speed of the G Plus Mini Dual Action Polisher can, in some spot repair applications, deliver both faster correction and finishing than its rotary compound.

Some G Mop applicators are compatible across both Rotary and Dual Action machine types. Users should check product packaging and the product listings for compatibility guidance and recommended operating instructions.

Although both machine types have their own strengths, the polishing action itself does not limit the achievable finish. An experienced operative can achieve high levels of correction and finishing with either Rotary or Dual Action systems when used correctly.

Many Farécla process guides and solutions are designed around a preferred machine type. However, users with access to both Rotary and Dual Action polishers may mix and match recommended processes and product combinations according to operator preference and application requirements to achieve optimal results.

Yes, dual-action polishers can effectively remove light to moderate surface defects such as swirl marks, fine scratches, and oxidation. However, deeper scratches may require a more aggressive compound or a rotary polisher for complete removal.

A 15mm throw on a dual action (DA) polisher refers to the diameter of the orbital motion the pad makes during operation. Specifically, it indicates that the pad oscillates 15mm away from the center of the backing plate in all directions, creating a circular path.

Why is throw size important?

• Larger throw (15mm or more):
  • Covers more surface area per pass
  • Provides faster correction on large panels
  • Offers more aggressive cutting power for quicker defect removal
• Smaller throw (e.g., 8mm):
  • Allows greater precision and control in tight areas
  • Requires more time to cover large surfaces

A 15mm throw strikes a balance between speed and control, making it popular for both cutting and finishing on larger surfaces like car bonnets and doors.